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Key Business
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Data Center Solutions
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Power & Electrical Facilities
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ICT Infrastructure
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Defense Industry
Power &UPS LFP Battery Switchgear &
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EN
Business Areas
Data Center Solutions
We provide the latest data center solutions with
safety, efficiency, and flexibility.
OCP · HPC
Smart PDU
Linkeo PDU, developed based on the extensive expertise of the Legrand Group, is designed to meet the needs of both operators and end users. It minimizes the time and cost required for installation and maintenance, while enhancing user convenience and power measurement accuracy.
Provides highly accurate monitoring data
Power data can be monitored with high accuracy through LPM (Local Power Meter) PDUs and metered/switched PDUs. As a result, it provides more reliable information to support customer decision-making.
Enhanced uptime
Built with a compact aluminum chassis rated for 55°C, it can withstand high ambient temperatures and is equipped with high breaking-capacity electromagnetic circuit breakers.
Input cord with 330° rotation capability
With a rotatable input cord design, the PDU can be installed in racks more easily.
Hot-swappable controller
The controller can be removed and replaced without interrupting PDU power supply.
High-density C13 outlet module
With a compact high-density outlet module design, improved airflow within the rack is achieved.
Universal cord locking system
For complete safety, the automatic locking system provides a 100 N retention force, preventing accidental power disconnection caused by operator error or vibration.
Numbered outlets
Independent circuits and power outlets are numbered from the input side, making power cord configuration easier.
PDU color coding
Upon customer request, circuit identification and color coding can be customized for additional identification requirements.
OCP · HPC
ORV3 (Open Rack V3)
ORv3 is a next-generation data center rack and power system specification based on the Open Compute Project (OCP) standard, optimized for high-performance computing (HPC) and AI workloads.
Built on open standards, it aims to deliver efficiency, interoperability, and rapid deployment.
Key features include support for 21-inch components, direct busbar power connections, high-efficiency power management
(30A / 30kW+), advanced cooling solutions (including liquid cooling), and improved integration of network equipment.
OCP · HPC
PSU (Power Self)
ORv3 PSUs meet the stringent requirements of modern data centers. The ORv3 33 kW PSU meets target efficiency requirements, delivering up to 97.5% efficiency. It provides stable and efficient power while its high-performance design ensures optimal operation of servers and networking equipment.
Built with cutting-edge technology, the ORv3 PSU sets a new industry benchmark for performance. As power demand continues to grow due to AI and machine learning, reliable PSU solutions have become essential.
OCP · HPC
BBU (Battery Backup Unit)
The BBU, optimized for the ORv3 architecture—OCP’s next-generation rack standard—provides immediate emergency power to servers via lithium batteries in the event of a main power failure at the data center, preventing data loss.
OCP · HPC
Cooling
The ColdLogik Rear Door Heat Exchanger (RDHx) is a high-efficiency cooling system designed for use in data centers and server cabinets. Engineered to operate within a closed-loop water circuit, it removes heat directly from active equipment, delivering optimal thermal and energy performance.
CL20
With LPM (Local Power Meter) PDU and metered/switched PDUs, power data can be monitored with high accuracy. As a result, it provides more reliable information to support customer decision-making.
CL21
The ColdLogik CL21 Smart Passive is designed to deliver high-performance cooling with zero operating cost when no active cooling system is running. Its performance relies entirely on the pressure generated by active equipment (servers) and server fans within the cabinet. With a chilled water inlet temperature of 14°C, the CL21 Smart Passive provides up to 29 kW of cooling capacity, making it ideal for data centers aiming for a sustainable operating model.
CL23
Designed to meet the demanding requirements of high-performance computing (HPC) cooling, USystems leads the industry with its proprietary RDHx technology, alongside chip cooling and immersion cooling solutions. The CL23 HPC delivers exceptional cooling performance of up to 200 kW per rack, setting a benchmark for industry standards.
Unlike other high-performance cooling technologies, RDHx does not require specialized data center infrastructure or dedicated servers. It is designed for installation on standard IT racks and supports retrofit deployment in existing environments.
With a compact footprint, easy installation, and scalable design, the CL23 HPC offers outstanding cost efficiency across all aspects. Additionally, it is engineered to manage the entire room environment without the need for supplementary cooling systems, clearly differentiating it from other technologies in its class.
E-HWA ELECOMM Co., Ltd. | CEO Lee Jeong-sang
Address 1061-55 Hoean-daero, Gwangju-si, Gyeonggi-do, Rep. of Korea
Tel +82-31-798-9800-3 | Fax +82-31-798-9804
Email ehwaelecomm@daum.net
E-HWA ELECOMM Co., Ltd. | CEO Lee Jeong-sang
Address 1061-55 Hoean-daero, Gwangju-si, Gyeonggi-do, Rep. of Korea
Tel +82-31-798-9800-3
Fax +82-31-798-9804
Email ehwaelecomm@daum.net
About Us
Company Overview
Vision
History
Organization
Location
Sustainability Management
Integrity Management
Internal Reporting Center
ESG
About Us
Company Overview
Vision
History
Organization
Location
Sustainability Management
Integrity Management
Internal Reporting Center
ESG
© 2026. E-HWA ELECOMM Co., Ltd. All Rights Reserved.
